Xring O3

- 3nm process, flagship SoC
- 10-core CPU, brings 60% improvement
- 16-core G2-Ultra NX GPU, up to 85% improvement
- GPU power efficiency improved by 64%
- First mobile chip with LPDDR6
- Up to 113.8GB/s memory bandwidth
- 200 TOPS tensor AI performance
- 3.13 TFLOPS vector AI performance
- NPU performance up 45%
- AI acceleration across CPU, GPU, ISP, DPU and ADSP
- 82ns static latency
- Developed over 459 days
- 5.22M on AnTuTu (Claims to be first chip to cross 5 mililon AnTuTu mark)

XRing O100 (6nm)

- Advanced near-memory AI architecture
- Designed to overcome the memory wall
- Uses vertical chip and memory stacking
- Built with millions of high-speed vertical channels
1.22Tbps bandwidth
- Could power phones, cars and robots

Xring D100

- Xiaomi's first domestic 3nm intelligent-driving AI chip
- 20-core high-performance CPU
- 16-core high-compute NPU
- Supports up to 160GB unified memory
- Can locally run AI models with up to 200 billion parameters
- Commercial launch planned for 2027

HyperOS 4 System Launcher Update

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HyperOS 3.1 System Launcher Update 🔥

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HyperOS 4 System Launcher Update

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HyperOS 3.1 System Launcher Update 🔥

Version: RELEASE-7.50.06.2580-08201521

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HyperOS 4 System Launcher Update

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