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https://blog.wongcw.com/2019/08/13/ihs-markit%e7%99%bc%e5%b8%835g%e8%8a%af%e7%89%87%e6%8b%86%e8%a7%a3%e5%a0%b1%e5%91%8a%ef%bc%9a%e9%ab%98%e9%80%9a%e5%9c%a8%e5%b0%81%e8%a3%9d%e5%b0%ba%e5%af%b8%e5%92%8c%e8%83%bd%e6%95%88%e4%b8%8a/
IHS Markit發布5G芯片拆解報告:高通在封裝尺寸和能效上均領先